Hebei Ruiyun Wire Mesh Technology Co., Ltd.
Ultra-thin copper foam is an advanced porous metal material with thickness precisely controlled at the micron level, made from high-purity copper through a special process. It features a three-dimensional porous structure, high electrical conductivity, and a large specific surface area, making it suitable for a wide range of applications that require lightweight materials, high conductivity, and efficient thermal management. Ultra-thin copper foam is widely used in electronics, batteries, catalyst supports, heat dissipation, and filtration fields.
1.Thickness: 0.05mm-0.5mm
2.PPi: 35-200ppi
3.Surface density: 280g-2000g
1. Extremely Thin Thickness: The thickness of ultra-thin copper foam can be controlled between tens to hundreds of microns, making it suitable for applications that require high precision and flexible integration.
2. High Porosity and Specific Surface Area: With a porosity of over 90%, its large specific surface area helps increase reactive zones, making it an ideal electrode substrate and catalyst support.
3. Excellent Electrical Conductivity: Copper inherently has good electrical conductivity, and combined with a foam structure, ultra-thin copper foam excels in current transmission, making it ideal for electronic and electrochemical applications.
4. Lightweight: The material is lightweight but structurally strong, suitable for weight-sensitive devices and systems.
5. Good Mechanical Properties and Processability: While maintaining high mechanical strength, ultra-thin copper foam can be cut, bent, or further processed to meet complex geometric requirements.
1. Battery Electrode Material: Ultra-thin copper foam can serve as a negative electrode current collector in lithium-ion batteries, nickel-metal hydride batteries, and others, greatly improving charge-discharge rates and energy density. Its porous structure allows better distribution of active materials, increasing contact with the electrolyte, which enhances overall battery performance.
2. Supercapacitors: In supercapacitors, ultra-thin copper foam serves as electrode material, increasing the contact area between the electrode and the electrolyte, thereby enhancing charge storage capacity and providing higher power density and rapid charge-discharge capabilities.
3. Catalyst Support: In chemical reactions, ultra-thin copper foam, with its large specific surface area and excellent conductivity, is an ideal catalyst support, enhancing catalytic reaction efficiency. It is widely used in fuel cells and water electrolysis for hydrogen production.
4. Heat Dissipation: Ultra-thin copper foam is widely used in electronic devices and heat dissipation modules. Its high thermal conductivity and porous structure help dissipate heat quickly, maintaining the stability of electronic equipment, making it an ideal material for high-performance thermal management.
5. Filtration and Separation: With its porous characteristics, ultra-thin copper foam can be used as a filtration material for gases or liquids, providing effective solutions in industrial filtration and separation systems.
1. High Electrochemical Performance: The porous structure and high conductivity of ultra-thin copper foam ensure efficient performance of electrode materials, making it suitable for energy storage devices and electrochemical applications.
2. Enhanced Reaction Efficiency: As a catalyst support, ultra-thin copper foam provides a larger adhesion area and more active sites for catalyst particles, thus improving the rate and efficiency of overall reactions.
3. Lightweight and Flexible: The lightweight nature of the material makes it suitable for portable devices with strict weight requirements, as well as advantageous for efficient integration in compact spaces.
4. Easy Processing and Integration: The ultra-thin thickness allows it to be easily cut, bent, or shaped into various forms, meeting different application needs and integrating well into complex systems.
· Improved Energy Storage Device Performance: The use of ultra-thin copper foam in batteries and supercapacitors effectively increases energy density, extends life, and enhances charging and discharging efficiency, making these devices more competitive for high-performance applications.
· Efficient Thermal Management: In thermal management, ultra-thin copper foam offers effective heat dissipation pathways, allowing for efficient heat transfer and dissipation, thus protecting electronic devices from overheating.
· Environmentally Friendly and Recyclable: Copper is a recyclable material, which makes ultra-thin copper foam a preferable choice in terms of environmental sustainability, aligning with green development requirements.
With its excellent physical properties and flexibility, ultra-thin copper foam has become a key material choice in many fields. Whether for electrochemical energy storage, catalytic reactions, or heat dissipation and filtration systems, ultra-thin copper foam delivers outstanding performance, providing efficient and reliable solutions for engineering and industrial applications.
Company Advantages
Robust Infrastructure
Hebei Ruiyun Wire Mesh Technology Co., Ltd. owns modern production equipment and advanced production processes. The company covers an area of 30,000 square meters and is equipped with over 180 fully automated production lines, including cutting machines, drawing machines, weaving machines, and welding equipment. With an annual production capacity of over 120,000 square meters, we efficiently meet the demands of large orders. The company has fixed assets of RMB 35 million, ensuring our leading position in the industry.
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Our R&D center is equipped with advanced testing equipment capable of performing various physical and chemical performance tests to ensure product quality meets international standards.